Wafer tape

The configuration of the temporary bonding adhesive tapes are engineered for high reliability for wafers and substrates with extensive bumped features or flat with nominal or no features.

Tape Mount

Wafers requiring grinding and thinning to 50 microns needs high performance adhesion and yet easily release on demand either by UV or heat curing.

The high temperature controlled release tape has a conformable compressible layer of and micron thickness to accommodate bumped wafers with gold or solder bumps respectively.

wafer tape

Both UV-releasing type and high temperature controlled peel strength types are available for optimizing specific applications. Same peel strength and removal property before and after transportation for more than 30 days after mounting. Follow by suitable solvents Please consult AIT engineering for assistance for complete dissolution cleaning. Proprietary cleaning solvent is used to remove diced parts for TK Part-on-liner may be placed on a suitable wire-rack and soaked in solvent bath sequence for complete dissolution and cleaning of adhesive residue.

AIT technical sales and service department can also be reached at: or EST and Fax: Wafer Back Grinding Tapes. Typical temporary bonding and backgrinding operations leave no or minimal residual on the wafers or substrates and require no cleaning. Note 1: All backgrinding and thinning temporary materials are free of silicones or siloxanes. Note 2: Anti-static versions are available for all UV, heat or peel release temporary bonding.As the global spread of COVID affects every one of us, we continue to moinitor the latest updates and information regarding the outbreak, and have taken additional measures to safeguard the health of our employees and their families while following federal, state, and local guidelines.

The welfare, health and safety of everyone is paramount as we face this crisis. COVID has impacted the entire global supply chain and will continue to do so for an undeterminable time. Despite the pandemic, we have identified critical areas that ensure our operation and our ability to supply our customers and partners with a priority of maintaining the supply chain to Critical Infrastructures Sectors outlined by CISA www.

We remain committed to fulfilling critical customer needs and ensuring business continuity. All Rights Reserved. Content on this page requires a newer version of Adobe Flash Player. UV Curing Systems. Die-Matrix Expanders.

Wafer Cleaning Systems. Wafer Backgrinding Protective Film Remover. Wafer Backlapping Film Applicator. Grip Rings.

Film Frames. Grip Ring Separator Tool. Grip Ring Magazines.We inventory a variety of tapes which are manufactured specifically for semiconductor wafer dicing and for ceramic hybrid substrate sawing.

These tapes are also useful for surface protection and many other applications that require an adhesive tape with relatively low adhesion, no adhesive transfer, and the ability to stretch without tearing. It is tough, has high tear strength and elongation. It is used extensively for Wafer Sawing, Scribing, Expanding. These tapes are available in rolls suitable for all automatic and manual wafer mounting systems where the wafers are being mounted onto tape and film frames.

Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker dicing tape. Please contact our Tape Specialist for additional information at Home About S. What's New Press Releases. Application Notes Published Articles.

Wafer Film Frame Dicing Tape Applicator Model 3150

Request a Quote. Brochure Download. Tape for Semiconductor wafer dicing and hybrid substrate sawing.

wafer tape

Adhesion level is slightly greater than Low Tack-Blue to more firmly hold die to tape but low enough to easily remove die in the next operation. Same adhesion level as Low Tack Blue. Same adhesion level as Medium Tack Blue.

wafer tape

Squares All the above tapes are available in precut squares mounted on release paper. Standard sizes are 5. Custom sizes are available. A handy way to dispense tape for users without tape handling equipment. Also ideal for use with interlocking rings.Ultra clean, protective tape for silicon wafer back-grinding process in semiconductor manufacturing. Environmental friendly.

ICROS Tape can be processed using a "no rinse" process, which is shorter than conventional processing methods resulting in lower production costs and minimum wafer breakage. The consistency in its wafer thickness after back grinding and minimal wafer breakage are only two of the attributes that contribute to its reputation and reliability.

The UV tape of the ICROS backgrinding wafer tape line features high adhesive strength, no contamination transferred to the wafer surface, outstanding topography absorption, prevents water penetration and wafer breakage, and superior TTV.

It features a special resin middle layer for good bump absorption. Thin adhesive layer to prevent water penetration and wafer breakage. This tape has a warpage of 2mm versus 26mm for conventional tape which reduces risk of wafer breakage during handling and transportation.

In addition, the super clean adhesive is designed to eliminate the rinse process. Through the production process, Mitsui Chemicals adheres to a strict QC System eliminating foreign matter and defects producing high performance solutions. All components are produced at the facility. ICROS tape offers high performance solutions for your process.

Our experienced professionals will conduct a needs analysis to determine the tape that best fits your application.

Usage detail. Product inquiries. Super softness No contamination Uniform thickness. Superior TTV Soft adhesive provides for good bump absorption High cohesive strength and high molecular weight will result in no residue after removal Low ionic impurities. Superior TTV Soft intermediate layer provides for good bump absorption Low ionic impurities Low adhesive strength after UV irradiation makes detaping easy.

Acid resistant No Deformation Hardness for wafer support High adhesion No residue after removal Low adhesive strength increase with heat. The cleanest tape in the industry gets a new factory. Contact Us Contact Form.This site uses JavaScript. Please enable JavaScript in your browser settings to view its contents. About Us. Investor Relations. Datasheet Download. SDS Download. The information contained herein is based on all the documentation, information and data that can be obtained as of the date issued.

However, Nitto Denko Co. Details from the test methods are described on the customer product specification. Semiconductor wafer processing tape designed for excellent stability under various conditions of processing. Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing. V-8AR has an ideal adhesion level to keep the wafer on place during wafer dicing and shows a stable adhesion strength behavior on silicon wafer in function of time.

The tape has an excellent deformation behavior and elongation to allow ideal stretching during wafer processing. Adobe Reader is required to view PDF files. If not yet installed, please download it from the Adobe website. Search by Keyword. Financial Highlights year Summary. This product consists of a clear transparent PVC film coated with a pressure sensitive acrylicbased adhesive manufactured in clean room environment.

For easy unwind, the backing of the PVC-film is coated with a silicone release. The product is wound on a plastic core. Rolls are individually packed in a double polyethylene anti-static bag and foreseen with lot number. SDS Download The information contained herein is based on all the documentation, information and data that can be obtained as of the date issued.

Structure Pressure sensitive acrylic-based adhesive Clear transparent PVC film better visual inspection Silicone release coating.In electronics designtape-out or tapeout is the final result of the design process for integrated circuits or printed circuit boards before they are sent for manufacturing.

The tapeout is specifically the point at which the graphic for the photomask of the circuit is sent to the fabrication facility. Historically, the term references the early days of printed circuit design, when the enlarged for higher precision " artwork " for the photomask was manually "taped out" using black line tape commonly Bishop Graphics crepe.

In the post-war era of the —50s, the techniques developed for rapid and low-cost circuit reproduction evolved to photographically replicated 2D manufacturing. The verb "to tapeout" was already widely used for the process and adopted for transistor fabrication, which evolved to full integrated-circuit approaches. The process advanced to adhesive-backed die cut elements on sheets of PET film rubylith wherein a dimensionally stable mylar layer was loosely adhered to a red layer which was selectively removed high-resolution monochrome photographic film of that era had optimal sensitivity to the blue end of the spectrum — the red mask was translucent to humans but opaque to film.

Initially rubylith was manually separated [2] according to the engineers design parameters, and later automated via diamond-tip equipped x-y drafting machines driven by NC tape systems [ citation needed ] or direct computer output at the initial stages of the CAD revolution.

Some sources erroneously believe that the roots of the term can be traced back to the time when paper tape and later magnetic tape reels were loaded with the final electronic files used to create the photomask at the factory.

The term tapeout currently is used to describe the creation of the photomask itself from the final approved electronic CAD file. Designers may use this term to refer to the writing of the final file to disk or CD and its subsequent transmission to the semiconductor foundry ; however, in current practice the foundry will perform checks and make modifications to the mask design specific to the manufacturing process before actual tapeout.

Optical proximity correction is an example of such an advanced mask modification; it corrects for the wave-like behavior of light when etching the nano scale features of the most modern integrated circuits. A modern IC has to go through a long and complex design process before it is ready for tape-out. Many of the steps along the way use software tools collectively known as electronic design automation EDA.

The design must then go through a series of verification steps collectively known as " signoff " before it can be taped-out. Tape-out is usually a cause for celebration by everyone who worked on the project, followed by trepidation awaiting the first articlethe first physical samples of a chip from the manufacturing facility semiconductor foundry. The weeks before the tapeout are categorized as sleepless nights in the parlance of IC Designers.

First tapeout is rarely the end of work for the design team. Most chips will go through a series of iterations, called "spins", in which errors are detected and fixed after testing the first article.

Many different factors can cause a spin, including:. At the University of California, Berkeley, the tongue-in-cheek term tape-in was coined by Professor John Wawrzynek to allude to iterative "internal tape-outs" in the spirit of agile design philosophy around From Wikipedia, the free encyclopedia. This article may be too technical for most readers to understand. Please help improve it to make it understandable to non-expertswithout removing the technical details.

May Learn how and when to remove this template message. This article needs additional citations for verification. Please help improve this article by adding citations to reliable sources. Unsourced material may be challenged and removed. The Register. Retrieved April 2, Electronic Design.

Archived from the original on The Essential Guide To Semiconductors. Prentice Hall PTR. Retrieved Categories : Electronic design. Hidden categories: Use American English from April All Wikipedia articles written in American English Articles with short description Wikipedia articles that are too technical from May All articles that are too technical Articles needing additional references from December All articles needing additional references All articles with unsourced statements Articles with unsourced statements from January Namespaces Article Talk.

Views Read Edit View history. By using this site, you agree to the Terms of Use and Privacy Policy.Posted on: Posted by: admin-dicingusa. Die preparation is one step of the process that is used in semiconductor fabrication. During die preparation, it is necessary to properly mount and dice wafers. While there are several methods that can be used to mount wafers, using dicing tape is very common. Dicing tape is beneficial as it holds the die in place throughout the entire process.

It is important to select the correct type of tape when mounting wafers in order to achieve the best results. Standard tapes and UV release tapes are the two main categories of dicing tapes. Tapes may also come in different thicknesses and have different levels of adhesion. All characteristics of dicing tapes may have an effect on the way that the material is held and diced during processing.

Standard dicing tapes are generally blue in color and do not have a backing film. Standard tapes may vary widely in thicknesses, ranging from 80 microns to microns. Standard tape is best for use in dicing wafers of standard thicknesses that are being diced into large pieces, as the pieces can usually be taken of the tape relatively easily.

As implied by the name, UV release tapes do not allow materials to be released from the tape easily unless the tape is exposed to UV light. UV release tapes are usually clear and come in a large variety of thicknesses. The adhesiveness of the tapes may vary and may affect how easily the material is released from the tape even after UV exposure.

Dicing tape

UV release tape may be beneficial when dicing thicker wafers, as the pieces will be more likely to stay adhered to the tape throughout the entire process of dicing, whereas thicker pieces may come of when standard tape is used. If the adhesion level is high, UV release tape may not be ideal for thinner wafers or more fragile materials, as these materials may be difficult to remove after dicing and breakage may occur.

The thickness of the dicing tape is critical because it affects whether or not the appropriate cut depth can be achieved. When selecting tape thickness, the material thickness, material type, cut depth, blade thickness, and desired final die size should all be considered.

Taking all of these factors into consideration when choosing dicing tape thickness and type can help to prevent breakage, waste, and frustration. Most dicing tapes of any type or thickness will need time to cure prior to dicing. Four hours is the standard amount of time to allow the wafer to set on the tape in order to allow the wafer to properly adhere to the tape. If curing time is not allotted during the project, the wafer or die may come off of the tape, causing damage to the product.

Contact: Search for:. Selecting the Right Dicing Tape. Types of Dicing Tapes Standard tapes and UV release tapes are the two main categories of dicing tapes. Standard Tapes Standard dicing tapes are generally blue in color and do not have a backing film.

UV Release Tapes As implied by the name, UV release tapes do not allow materials to be released from the tape easily unless the tape is exposed to UV light. Thickness of Tape The thickness of the dicing tape is critical because it affects whether or not the appropriate cut depth can be achieved. Curing Time Consideration Most dicing tapes of any type or thickness will need time to cure prior to dicing. Share this:.

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